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Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
High Volume: iS6059 PCB Inspection
Efficient iS6059 PCB Inspection The iS6059 PCB Inspection combines precise fault detection with high inspection speed for mass production. Other benefits: Fast programming, intuitive operation, and Industry 4.0 integration. Camera technology: XMs-II / XM8-II 1 orth and 8 angled cameras Resolution: 10 µm/pixel / 8 µm/pixel FOV: 50 x 50 mm / 40 x 40 mm For: assembly inspection, component control, solder joint inspection
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
High Volume: iS6059 SPI
High-throughput 3D solder paste inspection with the most advanced sensors for shadow-free results and super-easy verification. 1 orth. and 4 angled cameras Resolution: 12 µm/pixel FOV: 58 x 58 mm Single-track transport system For: Solder paste inspection
S6053BO-V
Automatic optical wire bond inspection with configurable transport. Best inline technology for maximum performance - compatible with all Viscom bond camera modules. Particularly precise with height information thanks to 3D technology for thick-wire and thin-wire control. For: Wire bond inspection, semiconductor, package substrates
iX7059 PCB Inspection
The new 3D X-ray generation for highly accurate and fast inline inspection of printed circuit boards with a unique, dynamic image acquisition approach. Inspection objects up to 15 kg Rapid inspectioning speed and extremely fast handling For: Solder joint inspection, THT assembly and selective solder joints, void inspection surface soldering, LEDs, server boards, 3D computer tomography
iX7059 Heavy Duty Inspection
The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics. Inspection objects up to 40 kg Handling of workpiece carriers and soldering frames For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography
Multitalent X8011-III
The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming. For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment
Battery cell inspection
The Viscom subsidiary Exacom GmbH develops tailor-made X-ray solutions for high-precision battery inspection. The focus is on rapid image acquisition and handling of different cell types such as coin cells, cylindrical cells and pouch cells. For: Battery cell inspection, energy storage products