Duluth, GA, September 2017 — Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra blue in Booth #709 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The S3088 ultra blue addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price.
With one orthogonal and four angled view cameras, the S3088 ultra blue provides full 3D defect detection coverage for components and solder joints on PCBs.
The algorithm-based technology that Viscom provides will deliver greater measurement accuracy while inspecting components and solder joints, which in-turn provides feedback to gain tighter process control to optimize the overall quality for each product being produced.
Viscom offers a complete lineup of 3D inspection systems for the electronics industry. The portfolio includes solder paste inspection (SPI), automatic optical inspection (AOI), and X-ray systems (AXI/MXI) with micro-computed tomography (µCT) for the highest defect coverage.
For more information about Viscom, visit www.viscom.com.
Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, visit www.viscom.com.