Viscom’s S3088 SPI will be part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Viscom S3088 SPI
Viscom S3088 SPI

Duluth, GA, September 2015 – Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29 - 30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

The S3088 SPI combines the advantages of the market-leading AOI system with powerful 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected. All essential 3D features such as volume, height and form are recorded and checked, as are surface area, displacement and smearing. Additionally, Viscom´s FastFlow Handling provides extremely high throughput. Viscom’s TrueYield and its unique quality Uplink provide best-of-class defect inspection with optimal first pass yield.

The Solder Joint Automatic Inspection Experience will include AOI inspection of printed circuit board assemblies (PCBAs) for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL. For more information, visit http://www.smta.org/smtai/sMTAIExperience.cfm.

For more information about Viscom, stop by booth #506 at SMTA International or visit www.viscom.com.

 

 

About Viscom

Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3-D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006. For more information, visit www.viscom.com.

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