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Patrick Schwärzel
Viscom AG Deputy Vice President Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
patrick.schwaerzel@viscom.de +49 511 94996-748
Sascha Wilkening
Viscom AG Service Manager - Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Sascha.Wilkening@viscom.de +49 511 94996-647
Michael Hofmann
Viscom AG Project Manager - Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Michael.Hofmann@viscom.de +49 511 94996-651
High Volume: iS6059 PCB Inspection
Inspección eficiente iS6059 PCB Inspection La inspección iS6059 PCB Inspection combina la detección precisa de errores con una alta velocidad de inspección para la producción de series grandes. Más ventajas: programación rápida, manejo intuitivo e integración de la Industrias 4.0. Tecnología de sensores: XMs-II / XM8-II 1 cámara ort. y 8 cámeras inclinadas Resolución: 10 µm/pixel / 8 µm/pixel FOV: 50 mm x 50 mm / 40 mm x 40 mm Para: control de equipamiento, inspección de componentes, inspección de…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
productronica India 2024
18/09/2024 - 20/09/2024
BIEC
Delhi
India
International Trade Fair for Electronics Development and Production
productronica India showcases the entire value chain in electronics production in all industrial sectors. The fair has been one of the most important events in Asia since 2000.
Semicon Taiwan 2024
04/09/2024 - 06/09/2024
Taipei Nangang Exhibition Center
Taipei
Taiwan
Semicon Taiwan is an international trade fair for semiconductor technology and the most important trade event for the micro- and nanoelectronics industry in Taiwan. Topics include technologies for the development and manufacture of semiconductors, solar cells and other micro- and nanoelectronic products.
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
Sebastian Legierko
Viscom AG Sales Europe
Carl-Buderus-Str. 9-15 30455 Hannover Germany
sebastian.legierko@viscom.de +49 511 94996-849 +49 160 93607946 +49 511 94996-900
Michael Tröbs
Viscom AG Technical Sales Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
michael.troebs@viscom.de +49 511 94996-973 +49 160 96910522 +49 511 94996-900