- Practice-oriented, proven system concept
- Extensive system options and extensions
- Intuitive system operation
- High resolution and excellent image quality
- Automatic, personalized documentation of test results
- Information on radiation dose during X-ray inspection
- High target power of 40 W – open microfocus X-ray tube
- Universal, flexible exchangeable module for perfect sample handling
- Suitable for high-mix, low-volume manufacturing
Inspection Images from Viscom’s MXI Systems
Explore a selection of inspection images captured with Viscom’s MXI technology. The gallery showcases high-resolution X-ray imaging, revealing hidden structures, internal defects, and dimensional deviations with exceptional clarity. These examples demonstrate how advanced non-destructive testing supports reliable quality assurance across a wide range of industrial applications.
Technical Specifications
X-ray technology | X8011-III eco | X8011-III plus | X8011-III flex |
| X-ray tube | Sealed microfocus X-ray tube or open microfocus transmission tube (optionally also TXD X-ray tube, < 1.5 µm) | Sealed microfocus X-ray tube or open microfocus transmission tube (optionally also TXD X-ray tube, < 1.5 µm) | Sealed microfocus X-ray tube or open microfocus transmission tube (optionally also TXD X-ray tube, < 1.5 µm) |
| High voltage | 20 – 130 kV (sealed); 20 – 160 kV (open)** | 20 – 130 kV / 20 – 180 kV (sealed); 20 – 160 kV / 20 – 210 kV (open)** | 20 – 130 kV / 20 – 180 kV (sealed); 20 – 160 kV / 20 – 210 kV (open)** |
| Tube current | 50 – 300 μA / 5 – 1000 μA | 50 – 300 μA / 5 – 1000 μA | 50 – 300 μA / 5 – 1000 μA |
| Target power | Max. 20 W / max. 40 W | Max. 20 W / max. 40 W | Max. 40 W |
| Geometric magnification | Max. 35 times / max. 2650 times | Max. 35 times / max. 2650 times | Max. 2650 times |
| Image converter | High resolution 7.3" FPD, 14 bit | High resolution 7.3" FPD, 14 bit | High resolution 11" FPD, 14 bit (optional 16 bit) |
| JIMA proven resolution (at 90 kV/80 μA) | < 16 - 50 μm / < 4 μm / < 1.5 μm* | < 16 - 50 μm / < 4 μm / < 1.5 μm* | < 16 - 50 μm / < 4 μm / < 1.5 μm* |
| Detector swivel range, additionally via rotation and tilt axis +/- 45° (90°) | 0° | 0° – 60° | 0° – 60° |
| X-ray cabinet | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG), German Radiation Protection Ordinance (StrlSchV), CE mark and additional international standards for worldwide use. Radiation leakage rate < 1 μSv/h) | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG), German Radiation Protection Ordinance (StrlSchV), CE mark and additional international standards for worldwide use. Radiation leakage rate < 1 μSv/h) | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG), German Radiation Protection Ordinance (StrlSchV), CE mark and additional international standards for worldwide use. Radiation leakage rate < 1 μSv/h) |
Software | |
| User interface | Viscom XMC / Viscom SI optional / vVision-ready optional |
| Available software packages | Analysis software (BGA, QFN, THT, ACA); fully automatic Viscom SI analysis software; automatic inspection report; XVR CT software (planar, rotational); layer image analysis; Viscom HARAN and vVerify verification station; Viscom Quality Uplink to SPI, AOI and AXI from Viscom; Windows® (system computer operating system) |
Scope of inspection | |
| Components | Electronic components and SMT components (BGA, μBGA, flip chips, and assembled circuit boards) |
| Solder joints | Visible and concealed solder joints |
| Defects/defect features | Air inclusions/blow holes in the solder joint (voids), presence, offset, too much/insufficient solder, solder bridge, solder balls, solder sputter (optional), soldering defects, non-wetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, polarity error, wick-up effect (optional), head-in-pillow (balls), THT fill level and pin height |
system computer | |
| Monitor | High-resolution 27" LCD display for special depiction of grayscale values in the SMT and electronics sectors (DICOM Standard) |
Inspection object handling | X8011-III eco | X8011-III plus | X8011-III flex |
| Manipulator | X-Y-Z | X-Y-Z plus rotating platform | X-Y-Z plus rotating platform |
| Max. travel range of table | Horizontal x/y axis: 460 mm x 435 mm (18.1" x 17.1"); vertical z axis: 290 mm (11.4") | Horizontal x/y axis: 460 mm x 435 mm (18.1" x 17.1"); vertical z axis: 290 mm (11.4") | Horizontal x/y axis: 460 mm x 435 mm (18.1" x 17.1"); vertical z axis: 290 mm (11.4") |
| Max. travel range of rotation module | - | Horizontal x/y axis: 350 mm x 430 mm (13.7" x 16.9") Vertical z axis: 290 mm (11.4"), n x 360° | Horizontal x/y axis: 350 mm x 430 mm (13.7" x 16.9") Vertical z axis: 290 mm (11.4"), n x 360° |
| Inspection object weight | Up to 10 kg / 22 lbs (5 kg / 11 lbs with rotation module) | Up to 10 kg / 22 lbs (5 kg / 11 lbs with rotation module) | Up to 10 kg / 22 lbs (5 kg / 11 lbs with rotation module) |
| Test piece change | Motorized window opening | Motorized window opening | Motorized window opening |
| Optional additional axes available | Yes | Yes | Yes |
Other system data | |
| Power requirements | 400 V, 50 Hz, 3P/N/PE +/- 10%; average power consumption 0.9 kWh |
| System dimensions | 1343 mm x 2292 mm x 1707 mm (52.87" x 90.24" x 67.2") (W x H x D) |
| Weight | 2500 kg (5511.5 lbs)* |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
