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Identify wire defects with absolute reliability Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. A
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X8011-III – 2D and 3D X-ray inspection fast, smart, economical and easy By loading the video, you accept the YouTube privacy policy. Learn more Load video Always unblock YouTube The Viscom X-ray syste
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Quick, Precise Inspection – X7056-II BO for Bonding Wires Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The X7056-II BO
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Keeping You up to Date with the Latest Developments in Inspection Technology Viscom inspection systems are also a good long-term investment. Our upgrades provide you with the benefits of new technolog