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  • High Volume: S3088 ultra chrome SPI
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  • S3088 ultra/ultra gold – High-Speed 3D AOI
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  • S3088 DT – Dual Track AOI
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  • S3088 ultra chrome – High-Performance 3D AOI
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  • S3016 ultra – Bottom-Side 3D-AOI
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  • S2088-II F – Desktop AOI
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  • Auxiliary modules brochure
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  • X7056-II – 3D-AXI/3D-AOI
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  • X8011-II PCB – 3D-MXI
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  • X8068 – 3D-MXI
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  • Inline: iX7059 Heavy Duty
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  • Inline: iX7059 PCB (XL)
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  • iX7059 Module Inspection
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  • Flexible transport solutions for 3D AOI and 3D AXI
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  • MXI systems: team players for special tasks
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  • Microfocus X-ray inspection
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  • S6053BO-V – Inline AOI
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  • S6056BO – Inline AOI
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  • X7056-II BO
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  • Technology brochure bond
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  • 3D Bond Inspection
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  • S3088 CCI – AOI
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  • Computed Tomography
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  • EasyPro3D brochure
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  • vVision brochure
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  • Company Profile
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  • Service
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  • Highly informative results with 3D AOI - Quality from all perspectives
    In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. From image quality and analysis of results to the networking of inspection data in order to optimize production processes, the technologies used continue their relentless development. EPP, 11/2019
  • Fast in-line X-ray secures quality
    High-quality systems for automatic optical inspection (AOI) of electronic assemblies offer as standard features both high throughput and 3D. For hidden solder joints, more and more electronics manufacturers want to employ in-line X-ray systems (AXI) as well. Again, it comes down to fast assembly handling and first-class 3D image quality. One example is the secure detection of voids as required in manufacturing of products with light-emitting diodes (LEDs) and other applications. EPP Europe, 11/2018
  • Total control with automatic in-line inspection
    Valuable data and images for attaining a stable process Highly effi cient defect detection is not the only capability that makes automatic inspection systems an indispensable element in electronics production. The information they deliver also helps optimize production processes. EPP Europe, 05/2018
  • Building Versatility into High-Throughput X-Ray Inspection
    3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate manual X-ray inspection (MXI) processes. In the inspection of electronic assemblies, especially for components with hidden solder joints such as BGA or QFN packages, AOI is insufficient. Random samples with MXI are another option, but this is not always the best solution. Where product safety plays an especially crucial role, particularly in the automotive area, a fast, thorough inspection of solder joints is needed. This calls for in-line, high-speed AXI. On these systems, throughput is determined by the inspected assembly handling, since a fully protected housing with mechanical gates is required. US-Tech, 03/2018
  • Electronics production in Europe
    Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential. EPP Europe, 05/2017
  • Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components
    A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015
  • Intelligently networked 3D inspection
    DELTEC Automotive GmbH & Co. KG, S3088 SPI and S3088 ultra, January 2017
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  • The latest transmission controls for utility vehicles – inspected with 3D SPI and 3D AOI from Viscom
    WABCO GmbH, S3088 SPI and S3088 ultra, October 2016
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  • Effective wire bond inspection with combined X-ray and AOI inspection
    Danfoss Silicon Power GmbH, X7056BO, July 2014
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  • VISIONS - The Magazine for Viscom Partners
    December 2019
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  • Viscom Newsletter No. 39
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  • Viscom Newsletter No. 38
    December 2017
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  • Viscom Newsletter No. 37
    April 2017
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  • Viscom Newsletter No. 36
    October 2016
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  • Viscom Newsletter No. 35
    April 2016
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  • Viscom Newsletter No. 34
    November 2015
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  • Viscom Newsletter No. 33
    April 2015
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  • GPC
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  • GTC
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