3D Solder Paste Inspection Offers Many Potentials
Practical experience demonstrates that even if SMT lines are equipped with modern 3D SPI systems, their potentials are not always fully utilized. Measurements with a high degree of repeat accuracy, a very wide inspection spectrum, handling options way beyond what is standard plus versatile tools for networking and process control are all available today. Global SMT & Packaging, 10/2022
3D AXI Process- and Audit- Proof in Manufacturing
The range of applications for inline Xray is greater today than ever before. 2D and 3D inspections can be combined freely in the line cycle – while inspection objects are not only becoming more complex, but in some cases also increasingly larger and heavier. As important drivers, electromobility, renewable energies and state-of-the-art telecommunications electronics have posed new challenges for inline X-ray. Global SMT & Packaging 05/2022
Highly informative results with 3D AOI - Quality from all perspectives
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. From image quality and analysis of results to the networking of inspection data in order to optimize production processes, the technologies used continue their relentless development.
Fast in-line X-ray secures quality
High-quality systems for automatic optical inspection (AOI) of electronic assemblies offer as standard features both high throughput and 3D. For hidden solder joints, more and more electronics manufacturers want to employ in-line X-ray systems (AXI) as well. Again, it comes down to fast assembly handling and first-class 3D image quality. One example is the secure detection of voids as required in manufacturing of products with light-emitting diodes (LEDs) and other applications.
EPP Europe, 11/2018
Total control with automatic in-line inspection
Valuable data and images for attaining a stable process Highly effi cient defect detection is not the only capability that makes automatic inspection systems an indispensable element in electronics production. The information they deliver also helps optimize production processes.
EPP Europe, 05/2018
Building Versatility into High-Throughput X-Ray Inspection
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate manual X-ray inspection (MXI) processes. In the inspection of electronic assemblies, especially for components with hidden solder joints such as BGA or QFN packages, AOI is insufficient. Random samples with MXI are another option, but this is not always the best solution. Where product safety plays an especially crucial role, particularly in the automotive area, a fast, thorough inspection of solder joints is needed. This calls for in-line, high-speed AXI. On these systems, throughput is determined by the inspected assembly handling, since a fully protected housing with mechanical gates is required.
Electronics production in Europe
Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential.
EPP Europe, 05/2017
Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components
A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015