Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Premium S3088 ultra gold

Advanced 3D technology, rapid inspection speed, and flexible configurations make the S3088 ultra g our bestseller, adapting perfectly to your current and future requirements in high-end electronics manufacturing.

Camera module: XMPlus 
1 orth and 8 inclined cameras
Resolution: 10 µm/pixel
FOV: 50 x 50 mm

For: flat assembly inspection, component inspection, solder joint inspection, LED