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3D AXI

Reliable Inspection of Power Semiconductors

3D AXI
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iX7059 Module Inspection – High process efficiency through 3D X-ray and integrated CT

For manufacturers of power semiconductors, such as IGBT modules and SiC chips, compliance with safety and performance requirements is essential. The quality of each individual solder connection of the components ultimately determines whether overheating and thus failure will occur. The new iX7059 Module Inspection offers seamless and reliable quality assurance for this purpose. The fully automatic 3D X-ray system with integrated computed tomography is distinguished by easy-to-classify, accurate layer inspection images and a large inspection scope.
The X-ray system offers flawless handling of frame-based power modules or components on workpiece carriers. The iX7059 Module Inspection is compact and can be easily integrated into a line. There it fulfills - intelligently networked - all smart factory requirements.

 

Inspection Scope

  • Precise solder joint inspection for IGBT modules and SIC chips
  • Intelligent checking of voids for flawless heat dissipation
  • Easy to classify, accurate layer test images
  • Fast handling of workpiece carriers and solder frames for maximum throughput
  • Fast inspection program creation thanks to 3D analysis and an IPC-compliant AXI inspection library
  • Maximum inspection program optimization through integrated verification
  • Additional vertical slices for optimum analyses and dependable verification
  • High-quality 3D AXI volume calculation with planar CT
  • Global libraries, global calibration: transferability to all systems
  • Automated grayscale value calibration for consistent inspection results
  • Traceability, statistical process control, offline programming, multiline verification
  • Viscom Quality Uplink: effective networking and process optimization
  • Interfaces: SMEMA, IPC Hermes Standard (optional)
Scope of inspection: Twisted, missing or wrong component, hidden blow holes (voids) in surface soldering and THT solder joints
DIMENSIONS  
System housing: 1493 mm x 1654 mm x 2207 mm (W x H x D)
   
X-RAY TECHNOLOGY  
X-ray tube: Sealed microfocus X-ray tube
High voltage: 130 kV (up to 180 kV optional)
Detector: Type T2 FDP flat panel detector (T3 optional), 14-bit grayscale depth
Resolution: 9.5 - 25 μm/pixel
   
HANDLING  
Inspection object size: Up to 1000 mm x 660 mm (L x W)*
Inspection object weight: Up to 15 kg
   
SOFTWARE  
User interface: Viscom vVision/EasyPro
   
*Depending on configuration  

ADVANTAGES AT A GLANCE

  • 100% quality assurance
  • Future-proof, rapid 3D inline X-ray
  • Best defect coverage for zero defect strategy
  • Inspection of solid assemblies with 180kV
  • Intuitive programming

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