Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Solutions and systems for all inspection tasks in the electronics industry

High-precision inspection technologies that inspect concealed solder joints, miniaturized components or densely packed circuit boards fast and reliably are prerequisites for flawless, 100% reliable products. That's why electronics manufacturers need outstanding technological products for quality control. Viscom ranks among the world's leading providers of assembly inspection solutions for the electronics industry. Our wide range of state-of-the-art inspection systems offers the right solution for every inspection task.

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Meet Viscom at the following events

Viscom Technology Forum 2022
10/07/2022, Online-Event
Batteries Event 2022
10/18/2022 - 10/21/2022, Palais des congrès de Lyon, Lyon, France
Evertiq Expo Warsaw 2022
10/27/2022, PGE Narodowy Stadium, Warsaw, Poland

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Viscom Technology Forum 2022

We are already looking forward to October 07, 2022! Our digital event is exclusively for Viscom customers. You have the opportunity to participate live on our online event platform and ask all your questions, but also to watch the content on demand afterwards. Experience innovations from the areas of 3D SPI, 3D AOI, manual and automatic 3D X-ray inspection, 3D wire bond inspection as well as CCI, battery inspection and software.

Registration for Viscom customers