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Solutions and systems for all inspection tasks in the electronics industry

High-precision inspection technologies that inspect concealed solder joints, miniaturized components or densely packed circuit boards fast and reliably are prerequisites for flawless, 100% reliable products. That's why electronics manufacturers need outstanding technological products for quality control. Viscom ranks among the world's leading providers of assembly inspection solutions for the electronics industry. Our wide range of state-of-the-art inspection systems offers the right solution for every inspection task.

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Meet Viscom at the following events

Nepcon Microelectronics Asia
10/20/2021 - 10/22/2021, Shenzhen World Exhibition & Convention Center (Baoan) , Hall 17, Booth: 1E25, China
SMTA International
11/01/2021 - 11/04/2021, Booth: 3300, Minneapolis Convention Center, 1301 Second Ave S, Minneapolis, Minnesota, USA
productronica
11/16/2021 - 11/19/2021, Munich, Germany, Viscom in hall 2A, booth 177
All events

Latest information

New: 3D technology in wire bond inspection

The extended inspection depth results in even fewer pseudo-errors. Thanks to the additional height data, comprehensive bond inspection of complex assemblies is made possible. For thick and thin wire up to 20 μm in diameter.

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Unique precise 3D solder paste inspection

The new S3088 ultra chrome with its newly-developed XM sensors score with four side cameras for shadow-free images. Super-fast inspection and handling for the highest throughput. Smart facory compatible.

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3D THT and Press-Fit Pin Inspection

Our new S3016 ultra 3D AOI system inspects the undersides of printed circuit boards with the utmost precision and speed. In addition to SMD components, the S3016 ultra also inspects THT and press-fit pins for defects. Another advantage is the high transport clearance of 200 mm.

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Product Highlight

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All Inspection technologies

AOI

Automatic optical inspection for placement check and solder joint inspection

SPI

Fast, precise solder paste inspection in dual-track operation as well

AXI

Automatic inline X-ray inspection of electronic assemblies populated on one or two sides

MXI

Manual, semi-automatic and fully automatic X-ray inspection

Bond

Optical and X-ray inspection of bond wires

CCI

Automatic optical inspection of conformal coatings

News

Viscom Webinar Series

Are you a customer, partner, or a prospective customer in the electronics industry. Do you utilize inspection systems and would like to learn about new solutions? Then take advantage of our new free webinar series! In 30 minutes, Viscom experts will share compact, practical insights into solution concepts. Viscom offers everything from basic webinars to workshop webinars.

Register today