Viscom Milestones 2006 - 2016
2016
Extended range of systems in the 3D AOI area: The S3088 ultra gold system combines pioneering 3D inspection technology with high speed.
Viscom presents the new X-ray inspection systems at NEPCON South China in Shenzhen.
Technology Forum on the premises of the newly constructed Viscom building at Carl-Buderus-Straße 6.
2015
Viscom TrueYield – the unique toolbox for networked optimization of inspection quality and the entire process
2014
Viscom develops X-ray system X8068 for larger electronic assemblies.
Viscom presents the versatile Viscom 3D AOI system S3088 ultra with high-performance sensor technology.
Viscom celebrates its 30th anniversary.
2013
Viscom optimizes process control with Viscom Quality Uplink and Total 3D.
Viscom’s S3088 CCI inspects conformal coatings of electronic assemblies.
2012
Development of new high speed camera technology (XM module)
Viscom introduces the new inspection system for 3D solder paste inspection at the SMT.
First systems with the new operating software vVision are delivered.
2011
Best results since the company was founded
Viscom’s S3088 flex replaces the series III of the S3088 family as successor model.
Extension of the product family for wire bond inspection with the system S6056BO-V.
2009
Viscom celebrates its 25th anniversary.
2008
Independent business division Service established.
Viscom Inc. opens an application and training center in Mexico.
Viscom wins several awards in China and the USA.
2007
First of its kind: Optical inspection and simultaneous 3D X-ray inspection with the Viscom X7056
Opening of the new Viscom Application Center in Shanghai attended by Lower Saxony's Prime Minister.
2006
Presentation of the first AOI desktop system S2088.
Viscom Inc., the USA subsidiary, expands into its new headquarters in Duluth/Atlanta, Georgia.
Viscom listed on stock market in May 2006.