Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Viscom Milestones 2006 - 2016


Extended system offerings in the 3D AOI area: The S3088 ultra gold system unites pioneering 3D inspection technology with high speed.

Viscom presents the new X-ray inspection systems at NEPCON South China in Shenzhen

Technology Forum In the facilities of the newly constructed Viscom building at Carl-Buderus-Straße 6


Viscom TrueYield – The unique toolbox for networked optimization of inspection quality and the entire process


Viscom develops X-ray system X8068 for larger electronic assemblies

Viscom presents the versatile Viscom 3D AOI system S3088 ultra with high-performance sensor technology

Viscom celebrates 30th anniversary


Viscom optimizes process control with Viscom Quality Uplink and Total 3D

Viscom S3088 CCI inspects conformal coating of electronic assemblies


Development of new high speed camera technology (XM module)

Viscom introduces the new inspection system for 3D solder paste inspection at the SMT

First systems with the new operating software vVision delivered


Best results since company founded

Viscom S3088 flex replaces the series III of the S3088 family as successor model

Extension of the product family for wire bond inspection with the system S6056BO-V


Viscom celebrates 25th anniversary


Independent business division Service established

Viscom Inc. opens an applications and training center in Mexico

Viscom wins several awards in China and the USA


Worldwide unique: Optical inspection and simultaneous 3D X-ray inspection with the Viscom X7056

Opening of the new Viscom Applications Center in Shanghai in the presence of Niedersachsen Minister President


Presentation of the first AOI desktop system S2088

Viscom Inc., the USA subsidiary, expands into its new headquarters in Duluth/Atlanta, Georgia

Viscom listed on stock market in May 2006