Inspect Two Production Tracks with Only One System
iS6059 Dual Lane Variants – High-Speed System for Dual-Track Production
The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed. The 3D AOI system, which was developed for the economical large-scale production of assemblies, reliably inspects both components and solder joints. Within the manufacturing process, it can be intelligently networked for Industry 4.0 applications.
Inspection scope
- Inspection on two lanes at the same time
- Any options you would get with the single lane equivalents are available here, as well
- Robust system design
- Verified zero defect slippage thanks to integrated verification
- Flexible integration into existing productions
- Improved ergonomic design
- Global libraries, global calibration: transferability to all systems
- Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
- Traceability, offline programming, statistical process control
- Communication with MES systems
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- optional connection to the digital multi-purpose platform vConnect
| Components: up to 03015 and fine-pitch components |
| Solder paste, solder joint and assembly control |
| Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape |
| Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter |
| DIMENSIONS | |
| System housing: | 1100 mm x 2006 mm x 1753 mm |
| (43.3" x 78.9" x 69") (W x D x H) |
| CAMERA TECHNOLOGY | XMs-II | XM8-II | XMplus-II | XM-SPI-II |
| 3D sensor technology | ||||
| Z-resolution: | 0.5 µm | 0.5 µm | 0.5 µm | 0.1 µm |
| Z-range: | Up to 30 mm | Up to 30 mm | Up to 30 mm | Up to 5 mm |
| (1.1") | (1.1") | (1.1") | (0.1") | |
| Angled view cameras | ||||
| Number of megapixel cameras: | 8 | 8 | 8 | 4 |
| Orthogonal camera | ||||
| Resolution: | 10 µm | 8 µm | 10 µm | 12 µm |
| Field of view: | 50 mm x 50 mm | 40 mm x 40 mm | 50 mm x 50 mm | 58 mm x 58 mm |
| (1.9" x 1.9") | (1.5" x 1.5") | (1.9" x 1.9") | (2.2" x 2.2") | |
| INSPECTION SPEED | Up to 65 cm2/s | Up to 50 cm2/s | Up to 70 cm2/s | Up to 80 cm2/s |
| HANDLING | |
| PCB dimensions: | 450 mm x 350 mm (17.7" x 13.7"), minimum width 70 mm (2.7"); |
| Longboard option available for circuit boards up to 720 mm (28,3") in length* | |
| SOFTWARE | |
| User interface: | Viscom vVision, SI on request |
| Statistical process control: | Viscom vSPC/SPC, open interface (optional) |
| Verification station: | Viscom vVerify/HARAN |
| Remote diagnosis: | Viscom SRC (optional) |
| Programming station: | Viscom PST34 (optional) |
| *Depends on the individual configuration. Please contact us. |
Advantages at a glance
- Inspection on two lanes at the same time
- Any options you would get with the single lane equivalents are available here, as well
- IPC-compliant 3D assembly inspection
- Designed specifically for cost-effective mass production
- Meets the most demanding cycle time requirements
- Integrated verification for fewer false calls
