Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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The Process Control. For Your Quality.

In addition to the fast, reliable paste print inspection, the S3088 SPI system offers the unique Viscom Quality Uplink. This software feature enables e.g. the Closed Loop Connection to the paste printer and placement system. This information delivers indications of process weaknesses and enables a fast automatic optimization, e.g. by adapting the screen cleaning cycle or correcting print displacement or placement offset.

Moreover, the communication with an AOI, AXI or MXI Viscom system is also possible. The advantages are evident. By linking the inspection data, the operator has all SPI and downstream inspection information at a single glance. The SPI additional images at the AOI or verification station simplify defect evaluation and help prevent human errors - that results in less scrap and higher first-pass yield. Furthermore, a complete end-to-end documentation of all measurement data and inspection results is assured.

The Viscom Quality Uplink makes it easy to optimize costs, delivers maximum process security and enhances product quality over the long term. Plus, it lets you manage your process better than ever before. The Viscom Open Interface 4.0 can be used to network with systems from third-party providers within the SMT line.

Integrated verification for optimal inspection plans

All recorded error patterns are assessed at the verification station and stored as real defects or false calls. Integrated verification from Viscom ensures that defect images, once recorded and assessed, are also available for future optimizations. As a result, a valuable image database of good/bad patterns is simultaneously created for the AOI library. Using this IPC-compliant verification database makes it possible to automatically check whether the current parameter settings and threshold values correctly classify the stored defect images.


  • Easy optimization of false calls
  • Verification of real defects (verification station)
  • Avoidance of defect escape
  • Use of off-line programming – No blocking the AOI 
  • Always optimum inspection programs
  • Convenient use of global libraries 
  • Increased efficiency for product ramp-ups

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