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Solder Paste Inspection | 3D SPI


Conformal Coating Inspection


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Solutions and systems for all inspection tasks in the electronics industry

High-precision inspection technologies that inspect concealed solder joints, miniaturized components or densely packed circuit boards fast and reliably are prerequisites for flawless, 100% reliable products. That's why electronics manufacturers need outstanding technological products for quality control. Viscom ranks among the world's leading providers of assembly inspection solutions for the electronics industry. Our wide range of state-of-the-art inspection systems offers the right solution for every inspection task.

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Meet Viscom at the following events

Dallas Expo & Tech Forum
03/19/2024 - 03/19/2024, Plano Event Center, Plano, Texas, USA
productronica China 2024
03/20/2024 - 03/22/2024, Shanghai New International Expo Centre (SNIEC), Booth: E5.5716, Shanghai, China,
IPC APEX EXPO 2024
04/09/2024 - 04/11/2024, Anaheim Convention Center, Booth: 2828, Anaheim, California, USA,

Latest information

Unique precise 3D solder paste inspection

The new S3088 ultra chrome with its newly-developed XM sensors score with four side cameras for shadow-free images. Super-fast inspection and handling for the highest throughput. Smart facory compatible.

3D THT and Press-Fit Pin Inspection

Our new S3016 ultra 3D AOI system inspects the undersides of printed circuit boards with the utmost precision and speed. In addition to SMD components, the S3016 ultra also inspects THT and press-fit pins for defects. Another advantage is the high transport clearance of 200 mm.

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