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Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…
Steven Shen
Viscom Machine Vision Trading Co. Ltd. Sales Manager
2nd floor, Block D No. 1010 Kaixuan Road 200052 Shanghai Greater China
steven.shen@viscom.cn +86 13162730436
Ricardo Llinás
Importadora Poirot S.A. Product and Service Manager <p>Argentina, Bolivia, Chile, Colombia, Ecuador, French Guyana, Guyana, Paraguay, Peru, Uruguay</p>
Paseo Bulnes 205 Santiago Chile
ricardo.llinas@poirot.cl +56 2 26884466
High Volume: iS6059 SPI
High-throughput 3D solder paste inspection with the most advanced sensors for shadow-free results and super-easy verification. 1 orth. and 4 angled cameras Resolution: 12 µm/pixel FOV: 58 x 58 mm Single-track transport system For: Solder paste inspection
Dave Pang
Viscom Machine Vision Trading Co. Ltd. Sales Manager <p>South China</p>
2nd Floor Block D No1010 Kaixuan Road 20005 Shanghai China
Dave.Pang@viscom.cn +86 15618935991