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Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
Axel Klapproth
Viscom AG Senior Technical Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Axel.Klapproth@viscom.de +49 511 94996-697
Melanie Daniel
<p>Childcare centre manager</p>
Vanessa Dorfmann
<p>Childcare worker</p>
Linda Jakup Garcia
Irene Babahmidou
Premium: iS6059 PCB Inspection Plus
Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. XMplus-II camera module 1 orthogonal and 8 inclined cameras Resolution: 20.4 µm/pixel…