Menu

Contrôle de la pâte à braser | SPI 3D


Inspection du vernis épargne


Inspection optique | Bureau


Solutions logicielles


Bienvenue dans notre nouvelle médiathèque

Vous y trouverez des brochures produits, des livres blancs, des témoignages etc. à télécharger

> Aller à la médiathèque

Vous êtes ici :

New Inline X-ray System X7056-II BO for High-Throughput Wire Bond Inspection

Actualités sur les produits

Hanover, October 05, 2020The role of power electronics is becoming increasingly critical in the automotive sector, especially for electric drives. Smooth functioning and long service life for power electronics ensure the necessary product safety and also the intended energy efficiency of electric vehicles and hybrids. New sensors and cameras are also providing even better protection for vehicles during operation. The new Viscom X7056-II BO system, which inspects bond wires optically and radiographically in an inline system at maximum inspection depth, ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike.

The new X7056-II BO inline system effectively combines optical wire bond control with X-ray inspection to reliably and precisely inspect wire bonds – even enclosed ones – and concealed solder joints beneath chips. The unique combination of AOI and AXI in a single system ensures high-throughput handling to meet the most stringent cycle time requirements at a maximum inspection depth.

Tapes and wires, whether thick or thin, are inspected, as is the soldering quality of the dies. The high-resolution sensor technology means the scope of inspection covers all bond points and wires, as well as open and concealed connection points, so that the quality of wire runs, dies and component layers, damage and position deviations as well as voids in surface soldering can be detected with absolute certainty. The standard library contains all relevant inspection patterns for die bonds, ball-wedge, wedge-wedge and security bonds for very effective inspection program generation.

Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The system is designed to be used in the production of high-end electronics and is ideal for installation in final assembly for power electronics, circuits, sensor construction and packaging to ensure 100% quality control. The Viscom range is rounded off by powerful verification and evaluation of statistical process control.

Publication advice

Upon publication please send two voucher copies to:

Viscom AG
Marketing
Carl-Buderus-Straße 9 - 15
30455 Hannover